NTGS4111P, NVGS4111P
Power MOSFET
−30 V, −4.7 A, Single P−Channel, TSOP−6
Features
•
•
•
•
•
•
Leading −30 V Trench Process for Low RDS(on)
Low Profile Package Suitable for Portable Applications
Surface Mount TSOP−6 Package Saves Board Space
Improved Efficiency for Battery Applications
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Package is Available
http://onsemi.com
V(BR)DSS
RDS(on) TYP
ID MAX
38 mW @ −10 V
−30 V
−4.7 A
68 mW @ −4.5 V
P−Channel
Applications
• Battery Management and Switching
• Load Switching
• Battery Protection
1 2 5 6
3
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Value
Unit
Drain−to−Source Voltage
Rating
VDSS
−30
V
Gate−to−Source Voltage
VGS
±20
V
ID
−3.7
A
TA = 25°C
TA = 85°C
−2.7
TA = 25°C
−4.7
Steady
State
Power Dissipation
(Note 1)
Steady
State
t≤5s
Continuous Drain Current (Note 1)
TA = 25°C
PD
Steady
State
Power Dissipation
(Note 2)
1.25
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
6 5 4
W
1
t≤5s
Continuous Drain Current (Note 2)
4
2.0
TA = 25°C
ID
TA = 85°C
TA = 25°C
−2.6
A
−1.9
PD
0.63
W
IDM
−15
A
TJ,
TSTG
−55 to
150
°C
Source Current (Body Diode)
IS
−1.7
A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Rating
Symbol
Max
Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
100
°C/W
Junction−to−Ambient – t ≤ 5 s (Note 1)
RqJA
RqJA
1 2 3
Drain Drain Gate
62.5
Junction−to−Ambient – Steady State (Note 2)
TSOP−6
CASE 318G
STYLE 1
XX M G
G
200
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
THERMAL RESISTANCE RATINGS
XX
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information ion page 5 of
this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.006 in sq).
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 4
1
Publication Order Number:
NTGS4111P/D
