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1N63
1N6309US thru 1N6355DUS Available on commercial versions Qualified Levels: JAN, JANTX, JANTXV and JANS VOIDLESS HERMETICALLY SEALED 500mV GLASS ZENER DIODES Qualified per MIL-PRF-19500/533 DESCRIPTION This Zener voltage regulator series is military qualified and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 0.5 watt Zener voltage regulators are hermetically sealed with voidless-glass construction using an internal metallurgical bond. It includes Zener selections from 2.4 to 200 volts in standard 5% tolerances as well as tighter 1% and 2% tolerances. They are also available in axial leaded packages. Microsemi also offers numerous other Zener products to meet higher and lower power ratings in both thru-hole and surface mount packages. B-SQ Melf Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES Also available in: • Surface mount equivalent of JEDEC registered 1N6309 thru 1N6355 series. • • • Voltage tolerances of 1%, 2% and 5% are available. (See part nomenclature.) Voidless hermetically sealed glass package. Internal “Category I” metallurgical bonds for 1N6321US thru 1N6355US and “Category III” for 1N6309US thru 1N6320US. JAN, JANTX, JANTXV, and JANS reliability levels are available per MIL-PRF-19500/533. RoHS compliant versions available (commercial grade only). • • DO-35 package (axial-leaded) 1N6309 – 1N6355D APPLICATIONS / BENEFITS • • • • • • • Small surface mount Melf (“D” Package). Regulates voltage over a broad operating current and temperature range. Extensive selection from 2.4 to 200 volts. Standard and tight voltage tolerances available. Extremely robust construction. Non-sensitive to ESD per MIL-STD-750 method 1020. Inherently radiation hard as described in Microsemi “MicroNote 050”. MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-End Cap (1) 1N6309US – 1N6320US 1N6321US – 1N6355US Thermal Resistance Junction-to-Ambient (2) Steady-State Power Dissipation @ TEC = 150 oC Forward Voltage @ 1.0 A Solder Temperature @ 10 s Symbol TJ and TSTG Value -65 to +175 RӨJEC 35 21 240 0.5 1.4 260 RӨJA PD VF TSP Unit o C o C/W o C/W W V o C Notes: 1. See Figure 1 and Figure 2 for derating. 2. TA = +55 °C before derating on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1Oz Cu, horizontal, still air, pads = .067 inch (1.70 mm) x .105 inch (2.67 mm); strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, RΘJA with a defined thermal resistance condition included is measured at IZ = as defined in the characteristics and ratings table herein. MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0193-1, Rev. 1 (111899) ©2011 Microsemi Corporation Page 1 of 6
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