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XC2V3000-4BG728C

製品説明
仕様・特性

— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE — 1 Virtex-II Platform FPGAs: Complete Data Sheet R DS031 (v4.0) April 7, 2014 Product Specification Module 1: Introduction and Overview Module 3: DC and Switching Characteristics 7 pages 44 pages • • • • • • • • • • • • Summary of Features General Description Architecture Device/Package Combinations and Maximum I/O Ordering Examples Module 2: Functional Description 40 pages • Detailed Description - • • • Input/Output Blocks (IOBs) Digitally Controlled Impedance (DCI) Configurable Logic Blocks (CLBs) 18-Kb Block SelectRAM™ Resources 18-Bit x 18-Bit Multipliers Global Clock Multiplexer Buffers Digital Clock Manager (DCM) Routing Creating a Design Configuration Electrical Characteristics Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines Pin-to-Pin Input Parameter Guidelines DCM Timing Parameters Source-Synchronous Switching Characteristics Module 4: Pinout Information 227 pages • • Pin Definitions Pinout Tables - CS144/CSG144 Chip-Scale BGA Package FG256/FGG256 Fine-Pitch BGA Package FG456/FGG456 Fine-Pitch BGA Package FG676/FGG676 Fine-Pitch BGA Package BG575/BGG575 Standard BGA Package BG728/BGG728 Standard BGA Package FF896 Flip-Chip Fine-Pitch BGA Package FF1152 Flip-Chip Fine-Pitch BGA Package FF1517 Flip-Chip Fine-Pitch BGA Package BF957Flip-Chip BGA Package IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume. © 2000–2014 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. DS031 (v4.0) April 7, 2014 Product Specification www.xilinx.com 1

ブランド

XILINX

会社名

Xilinx, Inc

本社国名

U.S.A

事業概要

プログラマブルロジックデバイスの開発および販売

供給状況

 
Not pic File
データシート
pdf
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