HOME>在庫検索>在庫情報
CRG03TE85L,Q
CRG03 TOSHIBA Rectifier Silicon Diffused Type CRG03 General Purpose Rectifier Applications Unit: mm • Average forward current: IF (AV) = 1.0 A • Repetitive peak reverse voltage: VRRM = 400 V • Suitable for compact assembly due to small surface-mount package “S−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Repetitive Peak Reverse Voltage VRRM 400 V Average Forward Current IF (AV) 1.0(Note) A Peak One Cycle Surge Forward Current (Non−Repetitive) Junction Temperature Storage Temperature Range 15.0 (50Hz) IFSM A 16.5 (60Hz) Tj −40~150 °C Tstg −40~150 °C JEDEC ― JEITA Note: 1 Ta = 56°C Device mounted on a ceramic board board size: 50 mm × 50 mm soldering land: 2 mm × 2 mm board thickness 0.64t ― TOSHIBA 3-2A1A Weight: 0.013 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit VFM(1) Thermal resistance 0.86 ⎯ V VFM(2) IFM = 0.7 A (Pulse test) ⎯ 0.97 1.1 V IFM = 1.0 A (Pulse test) ⎯ 1.0 ⎯ V VRRM = 400 V (Pulse test) ⎯ ⎯ 10 μA Device mounted on a ceramic board Board size: 50 mm × 50 mm Soldering land: 2 mm × 2 mm Board thickness: 0.64t Repetitive peak reverse current ⎯ VFM(3) Peak forward voltage IFM = 0.1 A (Pulse test) ⎯ ⎯ 65 IRRM Rth (j-a) Device mounted on a glass-epoxy board Board size: 50 mm × 50 mm Soldering land: 6 mm × 6 mm Board thickness: 1.6t ― Rth (j-ℓ) °C/W ⎯ ⎯ 130 ⎯ ⎯ 20 °C/W Start of commercial production 2003-07 1 2013-11-01
TOSHIBA
株式会社 東芝セミコンダクター&ストレージ社
日本
半導体部門、DRAM、フラッシュメモリ、プロセッサ、汎用LSI
宅配業者の代金引換又は商品到着後一週間以内の銀行振込となります。