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XC4010E-3PQ160C
Product Obsolete or Under Obsolescence R XC4000E and XC4000X Series Field Programmable Gate Arrays XC4000E Electrical Specifications Definition of Terms In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as follows: Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device families. Values are subject to change. Use as estimates, not for production. Preliminary: Based on preliminary characterization. Further changes are not expected. Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final. Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction temperature conditions. All specifications subject to change without notice. XC4000E DC Characteristics Absolute Maximum Ratings Symbol VCC VIN VTS TSTG TSOL TJ Description Supply voltage relative to GND Input voltage relative to GND (Note 1) Voltage applied to 3-state output (Note 1) Storage temperature (ambient) Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm) Ceramic packages Junction Temperature Plastic packages Value -0.5 to +7.0 -0.5 to VCC +0.5 -0.5 to VCC +0.5 -65 to +150 +260 +150 +125 Units V V V °C °C °C °C Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot to VCC + 2.0 V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA. Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability. Recommended Operating Conditions Symbol VCC Description Supply voltage relative to GND, TJ = -0 °C to +85°C Supply voltage relative to GND, TJ = -40°C to +100°C Supply voltage relative to GND, TC = -55°C to +125°C VIH High-Level Input Voltage VIL Low-Level Input Voltage TIN Notes: Commercial Industrial Military TTL inputs CMOS inputs TTL inputs CMOS inputs Min 4.75 4.5 4.5 2.0 70% 0 0 Input signal transition time Max 5.25 5.5 5.5 VCC 100% 0.8 20% 250 Units V V V V VCC V VCC ns At junction temperatures above those listed above, all delay parameters increase by 0.35% per °C. Input and output measurement thresholds for TTL are 1.5 V and for CMOS are 2.5 V. February 11, 2000 (Version 1.8) 6-101 6
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